New Materials
Explore our New Materials chemical additives sourced from qualified Chinese manufacturers — competitive pricing, reliable quality. 9 products available.
New Materials
3Y-TZP Zirconia Powder
CAS: 1314-23-4
3mol% yttria-stabilized tetragonal zirconia polycrystal (3Y-TZP) powder, equivalent to Tosoh TZ-3Y. Delivers exceptional fracture toughness and flexural strength for high-performance structural and dental ceramics. ZrO₂+HfO₂ ≥94.5%, Y₂O₃ 5.15±0.2%, with tightly controlled median particle size (d50 0.3–0.6 μm) for dense, defect-free sintered bodies.
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8Y-CSZ Zirconia Powder
CAS: 1314-23-4
8mol% yttria-stabilized cubic zirconia (8Y-CSZ) powder, equivalent to Tosoh TZ-8Y. Engineered for solid oxide fuel cells (SOFC), thermal barrier coatings (TBC), and oxygen sensor electrolytes. Y₂O₃ content ~13.6% ensures fully stabilized cubic phase with high ionic conductivity (0.10–0.13 S/cm at 1000°C).
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Dental Zirconia Blanks
CAS: 1314-23-4
Pre-sintered 3Y-TZP zirconia CAD/CAM disc blanks for dental restoration milling. Available in standard (ST), high translucency (HT), and ultra translucency (UT) grades. Flexural strength ≥1200 MPa after final sintering. Compatible with all major open CAD/CAM systems for fabrication of crowns, bridges, implant abutments, and full-arch prostheses.
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Hollow Glass Microspheres (HL Series)
CAS: 65997-17-3
HL15-HL60S hollow glass microspheres made from alkali-lime borosilicate glass, with true density 0.13-0.63 g/cm³, crush strength 500-18000 psi, and median particle size (d50) 35-80 μm. Engineered for thermal insulation coatings, oil well cementing, lightweight composites, automotive putty, and buoyancy applications.
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Monoclinic Zirconia
CAS: 1314-23-4
Unstabilized monoclinic zirconia powder with ZrO₂+HfO₂ ≥99%. Used in refractory, foundry, and high-temperature applications where phase-transformation toughening is not required. High melting point (~2715°C), excellent corrosion resistance, and low thermal conductivity make it a key raw material for advanced refractories and investment casting.
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Nano Zirconia Powder
CAS: 1314-23-4
Ultra-high purity nano zirconia powder (≥99.9% ZrO₂) with precisely controlled particle size (d50 30–80 nm) and high specific surface area (BET 15–40 m²/g). Designed for advanced electronics, energy storage, and precision polishing applications where nanoscale uniformity and purity are critical.
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Zirconia CMP Slurry
CAS: 1314-23-4
Nano zirconia-based CMP (chemical mechanical planarization) slurry for semiconductor wafer polishing. Median abrasive particle size d50 <80 nm with tight PSD control. Delivers excellent material removal rate (MRR) with low defectivity for STI (shallow trench isolation) and ILD (interlayer dielectric) polishing steps.
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Zirconia Ceramic Ferrule
CAS: 1314-23-4
Precision 3Y-TZP zirconia ceramic ferrules for fiber optic SC, LC, and FC connectors. 125 μm bore with concentricity ≤0.5 μm ensures ultra-low insertion loss and high return loss. Manufactured via injection molding and precision lapping to telecom-grade tolerances (IEC 61754 / TIA-604).
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Zirconia Grinding Beads
CAS: 1314-23-4
Yttria-stabilized zirconia (YSZ) grinding and dispersion media in 0.1–3.0 mm sizes. Density ≥6.0 g/cm³ with Vickers hardness ≥1250 HV ensures low wear rate and long service life. Ideal for ultrafine grinding and dispersion of paints, inks, battery electrode slurries, and pharmaceutical suspensions.
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