Polyamide Wax Rheology Modifier for Adhesives
Polyamide wax rheology modifier is an organogelling agent that imparts thixotropy and sag resistance to solvent-borne, hot-melt, and reactive adhesive systems. It forms a three-dimensional gel network via hydrogen bonding that breaks down under shear for easy application and rebuilds at rest to prevent sag and settling. Polyamide wax is compatible with a wide range of resins including epoxies, polyurethanes, alkyds, and polyesters.
مشخصات فنی
| amineValue | 5–15 mg KOH/g |
| appearance | White to off-white powder or flake |
| ashContent | ≤0.1% |
| meltingRange | 90–140 °C (grade dependent) |
| particleSize | 10–50 µm |
حوزههای کاربرد
- Sag-resistant structural adhesives
- Non-drip epoxy and PU adhesive gels
- Hot-melt adhesive viscosity control
- Solvent-borne adhesive anti-settling agent
- Thixotropic potting and encapsulation compounds
ویژگیهای محصول
- Excellent thixotropy in solvent-borne and reactive systems
- Prevents sag on vertical surfaces
- Easy dispersion at elevated temperature
- Broad resin compatibility