Kürleme Ajanları
119 products
119 products
Kürleme Ajanları
Crosslinker
Crosslinkers are reactive chemical agents that form covalent bonds between polymer chains, converting linear or branched macromolecules into a three-dimensional network structure. By introducing intermolecular bridges, crosslinkers dramatically improve mechanical properties, solvent resistance, and thermal stability of coatings, adhesives, and elastomers. They are widely used in waterborne and solventborne systems across automotive, industrial, and packaging coatings.
Detayları Görüntüle →Kürleme Ajanları
Curing Agent
A curing agent is a chemical substance used to harden or cure resins, coatings, and adhesives through chemical crosslinking reactions. These agents react with functional groups in the base resin to form a three-dimensional network, imparting mechanical strength, chemical resistance, and durability. Curing agents are essential in epoxy, polyurethane, and other thermosetting resin systems used across industrial and protective coating applications.
Detayları Görüntüle →Kürleme Ajanları
Cyanoacrylate Instant Adhesive
Cyanoacrylate Instant Adhesive is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
Detayları Görüntüle →Kürleme Ajanları
Cycloaliphatic Epoxy Resin (3,4-Epoxycyclohexylmethyl-3,4-epoxycyclohexane Carboxylate)
Cycloaliphatic Epoxy Resin is a low-viscosity, aromatic-free difunctional epoxy offering exceptional UV stability and outdoor durability. Unlike aromatic epoxies, it resists yellowing and chalking under UV exposure, making it suitable for outdoor coatings, optical adhesives, and UV-curable systems. Cured systems exhibit high Tg, excellent electrical insulation, and very low moisture absorption.
Detayları Görüntüle →Kürleme Ajanları
DBP Peroxide Crosslinker
DBP Peroxide Crosslinker for curing and crosslinking polymer networks, enabling controlled cure profiles and enhanced mechanical, thermal, and chemical properties.
Detayları Görüntüle →Kürleme Ajanları
DCP Peroxide Crosslinker
DCP Peroxide Crosslinker for curing and crosslinking polymer networks, enabling controlled cure profiles and enhanced mechanical, thermal, and chemical properties.
Detayları Görüntüle →Kürleme Ajanları
DMP-30 (2,4,6-Tris(dimethylaminomethyl)phenol) Epoxy Accelerator
DMP-30 is a trifunctional tertiary amine and phenol accelerator widely used to catalyze epoxy curing with amines, polyamides, and anhydrides. It accelerates pot life reduction and reduces cure temperature, enabling room-temperature cure of systems that would otherwise require elevated temperatures. DMP-30 is also used as a standalone curing agent at higher loadings for rapid-cure adhesive and casting applications.
Detayları Görüntüle →Kürleme Ajanları
DOP (Dioctyl Phthalate) Plasticizer for Adhesives
Dioctyl Phthalate (DOP, also known as DEHP) is a general-purpose plasticizer used in adhesive and sealant formulations to impart flexibility, reduce glass transition temperature, and improve low-temperature performance. It is compatible with PVC, nitrile rubber, polysulfide, and polyurethane sealants, making it versatile across multiple adhesive technologies. In sealant formulations, DOP reduces hardness and extends service life in dynamic joint applications.
Detayları Görüntüle →Kürleme Ajanları
DPG Rubber Accelerator
DPG Rubber Accelerator for curing and crosslinking polymer networks, enabling controlled cure profiles and enhanced mechanical, thermal, and chemical properties.
Detayları Görüntüle →Kürleme Ajanları
DPMA Dipentaerythritol Crosslinker
DPMA Dipentaerythritol Crosslinker for curing and crosslinking polymer networks, enabling controlled cure profiles and enhanced mechanical, thermal, and chemical properties.
Detayları Görüntüle →Kürleme Ajanları
DTAP Peroxide Crosslinker
DTAP Peroxide Crosslinker for curing and crosslinking polymer networks, enabling controlled cure profiles and enhanced mechanical, thermal, and chemical properties.
Detayları Görüntüle →Kürleme Ajanları
Dibutyltin Bis(2-ethylhexanoate) (DBTEH) Catalyst
Dibutyltin Bis(2-ethylhexanoate) (DBTEH) is an organotin catalyst with lower toxicity and improved hydrolytic stability compared to DBTDL, used to accelerate cure in polyurethane and silicone adhesive and sealant systems. Its reduced tendency to hydrolyze makes it more suitable for moisture-sensitive formulations that require extended storage stability. DBTEH provides excellent catalytic activity for NCO-based reactions and is compatible with both solvent-free and solvent-borne PU systems.
Detayları Görüntüle →Kürleme Ajanları
Dibutyltin Dilaurate (DBTDL) Catalyst
Dibutyltin Dilaurate (DBTDL) is an organotin Lewis acid catalyst widely used to accelerate the cure of polyurethane adhesives and sealants, RTV silicone sealants, and moisture-curing silane-modified polymer systems. It catalyzes both the urethane (NCO-OH) and urea (NCO-H2O) reactions, enabling faster room-temperature cure without significantly reducing pot life at normal use levels (0.01–0.1 phr). DBTDL is the industry-standard cure catalyst for one- and two-component PU and silicone systems.
Detayları Görüntüle →Kürleme Ajanları
Dicyandiamide (DICY) Latent Curing Agent
Dicyandiamide (DICY) is the most widely used latent curing agent for epoxy resins, providing exceptional one-component stability at room temperature (>6 months) while curing rapidly at elevated temperatures (150–180 °C). Its fine particle size enables uniform dispersion in epoxy resin systems, giving one-part adhesive films, prepregs, and structural adhesives excellent shelf life and reproducible cure. DICY is the backbone of automotive structural adhesive films and aerospace prepreg systems.
Detayları Görüntüle →Kürleme Ajanları
Dimer Acid (Dimerized Fatty Acid) Flexibilizer
Dimer Acid is a C36 dicarboxylic acid produced by dimerization of unsaturated fatty acids (primarily oleic/linoleic acid), widely used as a flexibilizer and modifier in epoxy adhesive systems. When incorporated as part of the curing agent or as a reactive flexibilizer, it introduces long aliphatic chain segments into the epoxy network, dramatically improving peel strength, impact resistance, and low-temperature flexibility. Dimer acid-based polyamide curing agents are a cornerstone of flexible epoxy adhesive technology.
Detayları Görüntüle →Kürleme Ajanları
Dodecanedioic Acid (DDA) Latent Curing Agent
Dodecanedioic Acid (DDA) is a solid dicarboxylic acid used as a latent curing agent for epoxy and TGIC-free powder coating systems, offering excellent storage stability and a smooth, flexible cure at 160–200 °C. When used in combination with epoxy resins, DDA produces powder coatings and adhesives with good flow, high gloss, and improved flexibility versus anhydride-cured systems. Its lower reactivity at room temperature gives outstanding one-component stability.
Detayları Görüntüle →Kürleme Ajanları
EDB (Ethyl 4-(dimethylamino)benzoate) Amine Synergist
EDB (Ethyl 4-dimethylaminobenzoate) is a tertiary amine co-initiator and synergist widely used with Type II photoinitiators (benzophenone, thioxanthone) in UV adhesive and coating formulations. It donates a hydrogen atom to excited photoinitiator triplet states, dramatically accelerating surface and bulk cure rate and reducing oxygen inhibition. EDB also improves the yellowing resistance compared to aliphatic amine synergists, making it preferred for clear and light-colored UV adhesive systems.
Detayları Görüntüle →Kürleme Ajanları
EGDMA Crosslinker
EGDMA Crosslinker for curing and crosslinking polymer networks, enabling controlled cure profiles and enhanced mechanical, thermal, and chemical properties.
Detayları Görüntüle →Kürleme Ajanları
Epoxy Acrylate Oligomer (EA) for UV Adhesives
Epoxy Acrylate Oligomer (EA) is produced by reacting bisphenol A epoxy resin with acrylic acid, combining fast UV cure speed with high hardness, excellent chemical resistance, and strong adhesion to glass and metals. It is the most widely used UV-curable oligomer in adhesive applications, offering a high refractive index and low cure shrinkage. EA-based UV adhesives are used extensively in glass bonding, optical assemblies, electronics, and UV-curable printing ink applications.
Detayları Görüntüle →Kürleme Ajanları
Epoxy Curing Agent
Epoxy curing agents are hardeners specifically formulated to react with epoxide groups via ring-opening addition, producing highly crosslinked thermoset polymers with outstanding adhesion, chemical resistance, and mechanical performance. Common chemistries include polyamines, polyamides, anhydrides, and phenalkamines, each imparting distinct performance profiles to the cured epoxy system. Epoxy curing agents are the backbone of protective coatings, structural adhesives, civil engineering, and composite applications worldwide.
Detayları Görüntüle →Kürleme Ajanları
Epoxy Dicyandiamide Cure
Epoxy Dicyandiamide Cure is a high-performance specialty chemical additive widely used in industrial coating, adhesive, and material applications. Provides excellent performance characteristics and reliability.
Detayları Görüntüle →Kürleme Ajanları
Epoxy Novolac Resin (EPN/ECN)
Epoxy Novolac Resin (EPN/ECN) is a multifunctional epoxy resin derived from novolac phenol-formaldehyde condensates, providing high epoxy functionality (f > 2) and superior thermal and chemical resistance after cure. Its dense crosslink network yields adhesives and coatings with outstanding performance at elevated temperatures and in aggressive chemical environments. Novolac epoxies are commonly used in demanding industrial adhesive, electrical laminate, and chemical-resistant coating applications.
Detayları Görüntüle →Kürleme Ajanları
Epoxy Resin E44 (Bisphenol A, EEW 210-240)
Epoxy Resin E44 is a standard-grade bisphenol A diglycidyl ether (BADGE) with an epoxide equivalent weight of 210–240 g/eq and moderate viscosity, widely used in structural adhesives and composite matrices. Its balanced reactivity and adhesion to metals, concrete, and composites make it the industry workhorse for two-component epoxy systems. It cures readily with polyamine, polyamide, or anhydride curing agents to yield strong, chemically resistant bonds.
Detayları Görüntüle →Kürleme Ajanları
Epoxy Resin E51 (Bisphenol A, EEW 185-210)
Epoxy Resin E51 is a higher-purity, lower-viscosity bisphenol A epoxy resin with an epoxide equivalent weight of 185–210 g/eq, offering faster curing and improved processability compared to E44. It is a versatile base resin for solvent-free coatings, high-performance adhesives, and electrical laminates where low viscosity aids wetting and penetration. The resin delivers outstanding mechanical strength, dimensional stability, and resistance to moisture after cure.
Detayları Görüntüle →