Soft Gold Plating Brightener
Soft gold plating brightener is designed for use in acid gold cyanide baths to produce bright, ductile, low-stress gold deposits with purity of 99.9%+ and excellent wire bonding capability. The brightener controls grain size and surface morphology of the gold deposit to achieve optimal contact resistance and wire bondability for semiconductor and connector applications. Soft gold plating is the standard finish for edge connectors, bond pads, and precision electronic contacts.
Teknik Özellikler
| pH | 4.5-5.5 (bath pH) |
| appearance | Clear colourless to light amber solution |
| hardness (HV) | 60-90 (soft gold) |
| gold purity (%) | ≥99.9 |
| active content (%) | ≥20 |
Uygulama Alanları
- Semiconductor wire bonding pad gold plating
- PCB edge connector and contact gold finishing
- Precision electrical contact and relay plating
- Jewelry and decorative gold plating
- Medical implant and biosensor gold coating
Ürün Özellikleri
- High-purity soft gold suitable for wire bonding applications
- Low contact resistance for electronic connector applications
- Controlled grain structure for optimal bondability
- Stable bath chemistry with precise gold content control